Samsung announces all-new GDDR6 memory that’s set to meet the “enormous memory and computing power” it typically demands Workstation To create objects and environments in virtual spaces.
The company calls this “the industry’s first next-generation graphics DRAM technology,” which sees an improvement on traditional GDDR6 products by adding an additional DRAM device to effectively double the capacity and bandwidth, without the associated effects you’d normally expect with a larger form factor.
Samsung hopes GDDR6W can achieve these gains by using the same power footprint as GDDR6, which the chipmaker hopes will allow customers to use the newer technology without having to make drastic changes to existing hardware.
Samsung GDDR6W
This is managed by what Samsung calls Wafer Packaging Technology (FOWLP).
Smart packaging also sees the replacement of the traditional printed circuit board (PCB) with a redistributive layer, allowing for a more compact design with precise wire patterns, while seeing typical package thickness reduced from 1.1mm to 0.7mm.
The stacking involved in creating a FOWLP is also said to reduce manufacturing time and costs in a world where businesses and consumers are looking to tighten their spending.
“Using GDDR6W, we are able to enhance differentiated memory products that can meet different customer needs — a major step towards securing our market leadership,” explained Cholmin Park, Vice President of New Business Planning, Samsung Electronics Business.
Samsung hopes to use its GDDR6W for artificial intelligence and high-performance computing accelerators, but has also announced plans to bring it into a smaller form factor to fit devices like laptops.
While the likes of AMD and Nvidia are yet to support GDDR6W, Samsung plans to collaborate with its GPU partners to speed up the rollout.
